Polyamides and modified polyamides have been used for several decades by the coating industry. They cure very slowly below 15 deg C & need induction period to react with epoxy resins for good film formation.
In order to overcome the limitations of Polyamides, Admark has introduced a novel technology, Phenalkamides epoxy hardeners. Using the combined chemistries of Polyamide and Phenalkamine, the Phenalkamides curing agents offer the benefits of both, while mitigating their limitations. Admark’s Phenalkamides are surface tolerant, fast and low temperature curing, light colored epoxy curing agents with excellent anti-corrosion, and extended over-coat ability.
Phenalkamide technology can be used in many applications where polyamide technology currently prevails to bring a new level of performance, reliability, application latitude, and cost savings. The overall system will have fast cure, low temperature cure, and excellent corrosion protection.
W/w replacement for polyamides.
Short re-coating time, time saving.
All season curing agent, less inventory.
Do not require Induction period.
Can be cure at 5oC.
No need to use the accelerator.
Solid Content NVM [%]
Adhesive & Composites
High-viscosity, Flexibility, fast drying and good water resistance properties with solid epoxy resin.
68 – 72
70 % solid solution in xylene for better handing. Solventborne primer coating.
Medium-viscosity, 1:1 volume ratio with standard liquid epoxy resin.
Low viscosity, fast drying for solvent free coatings. Exhibits very good adhesion, flexibility along with good corrosion protection.